With the wide application of ceramic element in the project, such as cutting tools, auto valve packing (seals) element bearing piston rotor, make advanced ceramic grinding in grinding process has aggravated. Efficiency of ceramic components in the improvement of metal in terms of the corresponding performance and better has many advantages. However, favorable characteristics along with the difficulties in the processing process, the main reason is related with the grinding precision and surface quality of the components required for these advanced ceramics and the requirements of high hardness and stiffness. For brittle materials with excellent surface finish and high size precision grinding is an important process of molding. It is a complex process, including a complex interaction between a large number of variables, such as machine tools, grinding wheel, workpiece material and operating para meters. Precision ceramic components, the need for strict compliance with the close performance tolerances and surface finish, in the active surface polishing and grinding process of these components have a great impact on the reliability. There are a variety of factors, control of dimensional accuracy and surface finish in grinding, therefore, becomes a key issue for reliable performance prediction processing analysis or empirical model development.
  A uniformly continuous modeling must first from the most basic physical process, it gives the process of individual abrasive and workpiece interaction. Then, this must be extended to the whole process of grinding wheel in motion process. A single grit interaction can use the chip thickness of workpiece undeformed to display its characteristics. The undeformed chip thickness is a variable, is usually used to describe the ground surface quality and assess the overall competitiveness of the grinding system. However, there is not a comprehensive model that can be in a wide range of operating conditions to predict the undeformed chip thickness range. The reason lies in the fact that, in this process the influence of many variables. Many of these variables are nonlinear, interdependent, or is hard to quantify. Therefore, so far there is no feasible and experimental investigation can be very detailed but [3] limited applicability of the available models. So, try to predict the chip thickness not deformation for grinding of silicon carbide and diamond abrasive to develop a theoretical model.
  Despite the different research efforts over the last twenty years of ceramic grinding, need to establish the normative theory model to predict the chip thickness not deformation, to improve product quality, reduce processing costs increase creation. Because the surface of grinding wheel, the cutting edge surface of the workpiece on the surface of groove by the individual particles closely reflects the geometric particles. Therefore, considering the particle tip geometry it is possible to chip thickness undeformed assessment. Because the cutting edge size on the wheel surface of random nature of chip thickness, not deformation can not be predicted in a certain way. Because of this uncertainty, the undeformed chip thickness evaluation of a probabilistic approach is more appropriate, therefore any attempt to estimate the chip thickness not deformation should be natural probability.
  In addition, the nature of the contact behavior between the grinding process of grinding wheel and workpiece is one of major factors that contribute to the ground workpiece quality. The original contact deformation in grinding the importance of research and industry practitioners are aware of. Geometrically, deflection of partial contact can smooth surface effect of workpiece and the grounding component size precision of [4]. However, there are still many industries use "rule of thumb" or spark grinding technique to produce good surface quality and closed space tolerance components. These operations can be time consuming and reduce equipment productivity. Therefore, the development of a new undeformed chip thickness model to reliably predict the chip thickness without deformation of the original contact deformation in grinding operations must also be taken into account.